Glass Sleeves for Encapsulating Semiconductor (for Diodes)

Product Details
Customization: Available
Type: Electronic Sealing
Structure: Hollow
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  • Glass Sleeves for Encapsulating Semiconductor (for Diodes)
  • Glass Sleeves for Encapsulating Semiconductor (for Diodes)
  • Glass Sleeves for Encapsulating Semiconductor (for Diodes)
  • Glass Sleeves for Encapsulating Semiconductor (for Diodes)
  • Glass Sleeves for Encapsulating Semiconductor (for Diodes)
  • Glass Sleeves for Encapsulating Semiconductor (for Diodes)
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Basic Info.

Moh′s Hardness
6
Shape
Bulk
Function
Electromagnetic Function
Transparency
Transparent
Processing Method
Doping
Preparation Process
High Speed Cooling Method
Color
Clear
Application
Electronics & Instruments

Product Description

glass sleeves for encapsulating semiconductors(for bodies) 
Jinan Honhai glass Ltd, produces custom glass beads used to produce glass-to-metal feed throughs and hermetically sealed connectors within the electronics industry.
Glass tubes are used in numerous electronic applications where discrete electronic components must be protected, isolated from the environment or sealed. Some applications include reed switch bodies, fuse bodies, diode glass sleeve packages, lamps, transponders, flat panel displays and thermistors. The function of the glass varies by application, however, it is used many times to electrically insulate, passivate components or as a hermetic seal.

Glass is an ideal material for hermetically sealed packages because of its high dielectric rating, attachment properties to metal surfaces, and mechanical stability over a wide range of operating temperatures.  These features provide high electrical insulation, hermetic sealing of glass to metal, and high resistance to cracking as a result of thermal stress.
Examples include:
  • Specialty shaped reed switch bodies, fuse bodies, glass diode packages, glass RFID transponder bodies, and thermistor bodies
  • Glass diode bodies, diode glass sleeves, and Glass Sleeves for Encapsulating Semiconductor (for Diodes)
  • Reed switch encapsulation using a glass composition (IR absorbing glass) which can be laser sealed
The proprietary tubing and rod forming processes are capable of melting various glass compositions suitable for sealing glass to metals that include Kovar, stainless steel, tungsten and titanium. The precision glass forming processes provide the flexibility to produce low-volume prototypes or high-volume/low-cost production quantities
As the leading Chinese manufacture of borosilicate 3.3 clear and colored glass tube and rod with over 20 years' strong expertise and capability, we make glass tube and rod in a wide variety of outside diameters and lengths for numerous applications e.g pharmaceutical, electronics, industrial and environmental technologies. Borosilicate glass is all-purpose apparatus for the chemical industry, for pipelines and laboratory with chemically and thermally highly resistant. Borosilicate 3.3 glass tube and rod is widely used in architecture ( external architecture, interior design), art and design, lighting concept (halogen lamp, flash lamp, UV lamp), gauge glass,laboratory glass, drain (drainline) and vent pipe, photobioreactors (PBR algae production),pneumatic conveying system.
Now, we have four electrically melted glass furnaces with 15 glass drawing lines covering clear & colors glass tubing and rod in round, square, rectangular, hexagonal, triangular, profile, Conturax etc.. with total yearly production capacity over 30,000 tons.
we supply glass to the high quality demanding markets e.g U.S, European countries, Japan,  also Middle East countries, India, Russia, Latin American countries, North African countries etc..

Glass Sleeves for Encapsulating Semiconductor (for Diodes)Glass Sleeves for Encapsulating Semiconductor (for Diodes)Glass Sleeves for Encapsulating Semiconductor (for Diodes)Glass Sleeves for Encapsulating Semiconductor (for Diodes)Glass Sleeves for Encapsulating Semiconductor (for Diodes)Glass Sleeves for Encapsulating Semiconductor (for Diodes)Glass Sleeves for Encapsulating Semiconductor (for Diodes)Glass Sleeves for Encapsulating Semiconductor (for Diodes)Glass Sleeves for Encapsulating Semiconductor (for Diodes)Glass Sleeves for Encapsulating Semiconductor (for Diodes)Glass Sleeves for Encapsulating Semiconductor (for Diodes)
Glass Sleeves for Encapsulating Semiconductor (for Diodes)
 

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